Cau,
Mam i7 1366
Rozmyslam o novom top-performance kite 3x 2GB
Potreboval by som radu o moznostiach vyberu na slovensku kedze v tom mam dobry chaos.
Preferujem top performance kity (2000 a viac, nizke casovania, moznost oc, kompatibilita, spolahlivost..)
Dalej by ma zaujimalo ci sa chystaju nejake novinky (Dominator GTX LoVo..) a ako je to s lacnovanim pre rok 2011.
Dakujem.
DDR3 2011
-
- Nový používateľ
- Príspevky: 45
- Dátum registrácie: So 04. Apr, 2009, 21:48
- Bydlisko: Spišská Nová Ves
Re: DDR3 2011
Tak vzhladom na moj maly research a nazov fora som si dovolil predstavit maly prehlad niektorych zaujimavych modelov. Informacie este doplnim, korekcie vitam
2x2GB 4GB -||- DDR3-2133 -||- CL9 -||- Kingston HyperX XMP H2O Water c. kit
chip: Elpida BBSE (?)
cena: 122€ DPH
2x2GB 4GB -||- DDR3-2250 -||- CL9 -||- Kingston HyperX XMP T1 kit
chip: Elpida BDBG
cena: 128€ DPH
2x2GB 4GB -||- DDR3-2133 -||- CL7 (7-10-7-30) -||- OCZ Reaper
chip: Elpida MNH-E Hyper
cena: 137€ DPH
2x2GB 4GB -||- DDR3-2000 -||- CL9 -||- ADATA OC XPG.aming 2.0
chip: XEE218A3G-A (?)
cena: 73€ DPH
Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module
- All DRAM IC are verified by high standard criteria.
- High quality 2oz copper 8 layers PCB (Printed Circuit Board):
- Assist spreading of heat from critical areas to perform effective thermal cooling.
- Decrease the resistance of electronic flow to avoid electric waste.
- Increase DRAM module’s lifetime.
- Improve signal integrity.
- Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
- Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
- Feature Extreme Memory Profiles.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime Warranty.
3x2GB 6GB -||- DDR3-2000 -||- CL9 -||- ADATA OC XPG.aming
chip: XEE218A3G-A
cena: 136€ DPH
Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module
- All DRAM IC are verified by high standard criteria.
- High quality 8 layers PCB (Printed Circuit Board).
- Equipped aluminum heat spreaders to perform heat away from DRAM module.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime Warranty.
3x2GB 6GB -||- DDR3-2000 -||- CL8-9-8 2T -||- Corsair Dominator GT DHX
chip: ?
cena: 186€ DPH
3x2GB 6GB -||- DDR3-2400 -||- CL9 (9-11-9-28) 2T -||- Transcend AXERAM
chip: ??
cena: 112€ DPH
2x2GB 4GB -||- DDR3-2133 -||- CL9 -||- Kingston HyperX XMP H2O Water c. kit
chip: Elpida BBSE (?)
cena: 122€ DPH
2x2GB 4GB -||- DDR3-2250 -||- CL9 -||- Kingston HyperX XMP T1 kit
chip: Elpida BDBG
cena: 128€ DPH
2x2GB 4GB -||- DDR3-2133 -||- CL7 (7-10-7-30) -||- OCZ Reaper
chip: Elpida MNH-E Hyper
cena: 137€ DPH
2x2GB 4GB -||- DDR3-2000 -||- CL9 -||- ADATA OC XPG.aming 2.0
chip: XEE218A3G-A (?)
cena: 73€ DPH
Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module
- All DRAM IC are verified by high standard criteria.
- High quality 2oz copper 8 layers PCB (Printed Circuit Board):
- Assist spreading of heat from critical areas to perform effective thermal cooling.
- Decrease the resistance of electronic flow to avoid electric waste.
- Increase DRAM module’s lifetime.
- Improve signal integrity.
- Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
- Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
- Feature Extreme Memory Profiles.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime Warranty.
3x2GB 6GB -||- DDR3-2000 -||- CL9 -||- ADATA OC XPG.aming
chip: XEE218A3G-A
cena: 136€ DPH
Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module
- All DRAM IC are verified by high standard criteria.
- High quality 8 layers PCB (Printed Circuit Board).
- Equipped aluminum heat spreaders to perform heat away from DRAM module.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime Warranty.
3x2GB 6GB -||- DDR3-2000 -||- CL8-9-8 2T -||- Corsair Dominator GT DHX
chip: ?
cena: 186€ DPH
3x2GB 6GB -||- DDR3-2400 -||- CL9 (9-11-9-28) 2T -||- Transcend AXERAM
chip: ??
cena: 112€ DPH
Naposledy upravil/-a JoDo v Ut 28. Dec, 2010, 21:30, upravené celkom 2 krát.
Re: DDR3 2011
Bral by som OCZ... neviem ako to je s %RMA ale parametrovo vyzerajú najlepšie, OCZ ramky dosť preberá a testuje, takže máš istotu, že berieš to čo kupuješ... na večšie OC to nečakaj, ale časovanie by si znížiť mohol
Mobo Asus PRIME B450 Plus CPU Ryzen 7 5800X3D (Noctua NH-U12S + dual fan Noctua NF-A12) GPU MSI GeForce RTX 3070 Ventus 3X RAM G.Skill Ripjaws V F4-4000C18D-32GVK SSD Silicon Power P34A80 CASE Lancool 205 PSU Corsair RM550x case cooling: exhaust 2x Noctua F12, in-take 2x Lian Li 120mm
NB: Dell E7470 Skylake Core i5 + 16GB RAM + FHD IPS Foun: Oppo Reno 5Z
Main server: Asus PRIME A320M-K + Ryzen 5 2600 + GTX 1660Ti + 32GB Ram
NAS: QNAP TS-128 - 2TB Seagate Iron Wolf + MikroTik RB952
Peripherals: Dual monas setup 27" Samsung Odyssey G5 and AOC I2470Sw + Steelseries Apex 5 + Steelseries Rival 3 + QcK + Logitech G435
NB: Dell E7470 Skylake Core i5 + 16GB RAM + FHD IPS Foun: Oppo Reno 5Z
Main server: Asus PRIME A320M-K + Ryzen 5 2600 + GTX 1660Ti + 32GB Ram
NAS: QNAP TS-128 - 2TB Seagate Iron Wolf + MikroTik RB952
Peripherals: Dual monas setup 27" Samsung Odyssey G5 and AOC I2470Sw + Steelseries Apex 5 + Steelseries Rival 3 + QcK + Logitech G435
Re: DDR3 2011
dost vyhodene peniaze, tie ramky maju nizku voltaz, minimalne sa zahrievaju a vysoke frekvencie vyuzijes fakt len pri extremnom taktovani - a rozdiel vo vykone je minimalny... teda pri beznych ulohach nie pri prof. aplikaciach narocnych na ram
ceny su uz teraz dost nizko, velmi uz sa nebudu hybat imho
ceny su uz teraz dost nizko, velmi uz sa nebudu hybat imho